This website uses cookies. For further information on how we use cookies you can read our Privacy and Cookie notice
HomeHome & OfficeTools & Home ImprovementPower & Hand ToolsHand ToolsScrewdrivers & Nut DriversScrewdriver Sets4PCS Universal BGA Stencil for MTK MSM Samsung Huawei Xiaomi iPad CPU RAM PM Power IC Reball Pin Direct Heat Template
/product/55/006395/1.jpg?0243)
/product/55/006395/2.jpg?0243)
/product/55/006395/3.jpg?0243)
/product/55/006395/4.jpg?0243)
/product/55/006395/5.jpg?0243)
/product/55/006395/6.jpg?0243)
Share this product
Shipped from abroad
4PCS Universal BGA Stencil for MTK MSM Samsung Huawei Xiaomi iPad CPU RAM PM Power IC Reball Pin Direct Heat Template
GH₵ 76.63
GH₵ 153.2650%
In stock
Order above GHC 150 on Jumia Express items & get free delivery | regular delivery from GH₵ 5.36 to Tema
4.7 out of 5
(3 verified ratings)Promotions
Delivery & Returns
Shipped from abroad
Choose your location
Pickup Station
Delivery Fees GH₵ 14.88
Ready for pickup between 17 May & 22 May when you order within next 15hrs 46mins
Door Delivery
Delivery Fees GH₵ 26.78
Ready for delivery between 17 May & 22 May when you order within next 15hrs 46mins
Postal Shipping
Delivery Fees GH₵ 5.36
Ready for delivery between 05 June & 19 June when you order within next 15hrs 46mins
Return Policy
Free return within 15 days for all eligible items.Details
Seller Information
flowerrain
60%Seller Score
23 Followers
Seller Performance
Order Fulfillment Rate: Very Poor
Quality Score: Excellent
Customer Rating: Good
Product details
100% brand new and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.
Item Type: BGA Reballing Stencil
Colour: silver
Material: stainless steel
Package Contents:
4 x BGA Reballing Stencils
Only the above package content, other products are not included.
Note: Light shooting and different displays may cause the color of the item in the picture a little different from the real thing. The measurement allowed error is +/- 1-3cm.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.
Item Type: BGA Reballing Stencil
Colour: silver
Material: stainless steel
Package Contents:
4 x BGA Reballing Stencils
Only the above package content, other products are not included.
Note: Light shooting and different displays may cause the color of the item in the picture a little different from the real thing. The measurement allowed error is +/- 1-3cm.
Specifications
Key Features
BGA Stencil
Specifications
- SKU: GE779IP0WQZ7FNAFAMZ
- Weight (kg): 0.07
Verified Customer Feedback
See AllVerified Ratings (3)
4.7/5
4.7 out of 5
3 verified ratings
Comments from Verified Purchases (0)
Customers who have bought this product have not yet posted comments
/product/55/006395/1.jpg?0243)
4PCS Universal BGA Stencil for MTK MSM Samsung Huawei Xiaomi iPad CPU RAM PM Power IC Reball Pin Direct Heat Template
GH₵ 76.63
GH₵ 153.2650%
Questions about this product?