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Three-speed overclocking cooling for rapid temperature reduction
Whole-unit heat dissipation
Three adjustable temperature levels
Different fan speeds for each setting, switch freely between scenarios
Multi-layer cooling system gives your phone an “air conditioner”
Semiconductor-powered ultra-efficient cooling delivers instant chill upon power-up, offering gamers an entirely new cooling experience.
Breakthrough Cooling Technology: TEC Temperature Control Chip
Heat dissipation components have been completely upgraded. Custom-designed TEC ice-level cooling plates provide continuous cooling and heat dissipation, ensuring the entire system remains cool at all times.
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